Yes! Below are additional Lead-Free FAQs
Do any of eFabPCB's products contain the substances banned by the RoHS legislation?
Yes. Some printed circuit boards contain lead, which is a component of the Tin/Lead Hot Air Leveled Solder specified in many fabrication drawings.
Is there an alternative to Tin/Lead Hot Air Leveled Solder?
Yes. Alternatives available from eFabPCB are Immersion Tin(a.k.a. White Tin), OSP, Electroless Nickel Immersion Gold (ENIG or Au Flash), Immersion silver and Lead Free Hot Air Leveled Solder. More information on the pro’s and con’s of each of these processes is available.
| Final Finish Comparison Matrix |
Interpretation |
Immersion Silver (IAg) |
ENIG (Electroless Ni/Imm Au) |
Organic solderability coatings (OSP) |
Immersion Tin (ISn) |
HASL (no-lead) |
HASL (Tin/lead) |
| Lead free compatible, RoHS compliant |
required |
yes |
yes |
yes |
yes |
yes |
no |
| Solder joint integrity (how good and reliable is the solder joint) |
self explanatory |
very good |
good |
good |
good |
good |
best |
| Shelf life (with proper storage) |
self explanatory |
12 months |
12 months |
12 months |
12 months |
12 months |
12 months + |
| Assembly heat cycles (# of passes through reflow) |
> is better |
multiple |
multiple |
multiple |
multiple |
multiple |
multiple |
| Fab thermal shock (thermal shock during PCB fabrication) |
very low is best |
very low |
low |
very low |
very low |
high |
high |
| Wettable (how easily does the solder flow onto the surface) |
self explanatory |
very good |
good |
good |
good |
acceptable |
best |
| Solder paste printability (co-planarity of the finish for fine pitch devices) |
self explanatory |
excellent |
excellent |
excellent |
excellent |
poor |
poor |
| Solder pot compatible (low possibility of solder pot contamination) |
desired |
yes |
monitor Au concentration |
yes |
yes |
yes |
no (if using no lead solder pot) |
| Low contact resistance (resistance of the finish) |
yes is good |
yes |
yes |
yes |
no |
no |
no |
| Aluminum wire bonding (can this finish be used with Al wire bonding) |
yes is good |
yes |
yes |
no |
no |
no |
no |
| Process cost to PCB fabricator |
self explanatory |
med |
high |
low |
med |
high |
low |
| Sources: Cookson Electronics |
When can eFabPCB supply Lead-Free products?
Lead-Free Prototype and Production parts are available now. Let us contact your engineering group to determine the most compatible construction for your assembly process.
Will my assembly temperatures be affected.
Yes. Depending on the lead-free materials used. Most customers report an increase of aproximatly 30° C in reflow, and 10° C for wave solder pots, with both of these profiles requiring slightly longer dwell times. Results vary widely depending on chosen process and equipment.
Is FR-4 laminate RoHS compliant?
Yes. FR-4 laminates contain Tetrabromobisphenol-A (TBBPA) as a flame retardant. There are no legal restrictions on the use of TBBPA anywhere in the world. RoHS has only identified Polybrominated Biphenyls (PBBs) and Polybrominated Diphenyl ethers (PBDEs) as restricted substances.
It should be noted, however, that FR-4 has a glass transition temperature of 130° C-140° C. Other, higher Tg and Td laminates may be required for the elevated soldering temperatures. eFabPCBs highly trained representatives can help you to decide alternative choices if required.
Is the Lead-Free information I am reading on the internet accurate?
Unfortunately not in all cases. Some product manufacturer’s have manipulated facts in order to present their materials as being the easy lead free answer. This has created confusion and in some cases panic. As in all projects involving change, testing, doing your homework, testing sample runs, destructive testing, your customer involvement, life cycle testing;These are the only methods of insuring success. | 
